Pouya Asrar - Delivering advanced Packaging Solutions at Samsung

A senior manager at Samsung, Pouya Asrar has extensive knowledge in semiconductors and advanced packaging technologies, including high-density assembly and 2.5D/3D and heterogeneous integration methods. He is the customer's primary point of contact for marketing innovative packaging solutions. Pouya Asrar manages opportunities from initial discussions to ensuring that internal execution and customer requirements closely align. He provides support for technical evaluations and delivers engineering assistance across the product lifecycle.

Dr. Asrar built a strong base of knowledge in his field at institutions such as Iowa State University and the Georgia Institute of Technology. For his dissertation work at the latter institution, he tested, ran, and operated several microfluidic cooling devices crafted in the classroom employing microfabrication technologies. Dr. Asrar’s focus was on understanding the refrigerant R245fa’s two-phase flow across a thermal management loop equipped with components such as heat exchangers, heaters, and pumps.

Pouya Asrar has presented key research and findings at a number of international conferences and published an article in Electronics Cooling magazine. His professional background extends to past thermal engineering positions with Tesla and Amazon.